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KMID : 0362419940320030378
Journal of Korean Academy of Prosthodontics
1994 Volume.32 No. 3 p.378 ~ p.395
A study on the adhesive bond strength of composite resin to Au-Ag-Cu-Pd alloy
Seol Young-Hoon

Jung Chang-Mo
Jeon Young-Chan
Abstract
The purpose of this study was to investigate the effect of various metal surface treatments and adhesive systems on the flexural bond strength of composite resin to Au-Ag-Cu-Pd alloy. The specimens were divided into nine groups by the combinations of surface treatment methods and adhesive systems. The types of surface treatment in this study were alumina blasting only, alumina blasting-Sn plating, alumina blasting-heating and three kinds of adhesive system used this study were Silicoater system(Heraeus Kulzer GmbH, Germany), Superbond C & B (Sun Medical Co., Ltd., Japan) and Cesead opaque primer(Kurary Co., Ltd., Japan). After surface treatments and adhesive systems were applied, each specimen was bulit up with Dentacolor composite resin(Heraeus Kulzer GmbH, Germany). Four-points flexural bond strength was measured by Instron universal testing machine (Model 4301, U.S.A.) and modes of failure were observed by SEM(JEOL,SSM-840A,Japan). @ES The obtained results were as follows: @EN 1. The group that was bonded with Superbond C & B after alumina blasting-heating showed the highest bond strength with significant difference among the groups, except the group with Cesead opaque primer after alumina blasting-Sn plating (P<0.05). 2. In the groups bonded with Cesead opaque primer, there was significant difference only in the bond strength between she alumina blasting-Sn plating group and alumina blasting group, where the former showed a higher bond strength(P<0.05). 3. In the groups bonded with Silicoater system, there were no significant differences in bond strength regardless of the surface treatment method(P>0.05). 4. In SEM evaluation, the groups of high bond strength, especially bonded with Superbond C & B after alumina blasting-heating and Cesead opaque primer after alumina blasting-Sn plating, revealed mainly cohesive-adhesive failure, whereas the others showed the tendency of adhesive failure.
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